Plasma ashing
Product Description: Plasma Ashing System
Product Description
Product Description: Plasma Ashing System
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Unlock the Future of Precision Material Processing with Our Advanced Plasma Ashing System!
Are you tired of inefficient residue removal techniques that hinder your productivity and compromise your results? Look no further! Our state-of-the-art Plasma Ashing System is meticulously engineered to meet the demands of the modern manufacturing environment, ensuring superior performance in various applications, including semiconductor fabrication, microelectronics, and surface preparation.
Key Specifications:
- Plasma Source: 13.56 MHz RF generator for optimal plasma uniformity
- Gas Compatibility: Supports a wide range of gases, including O2, CF4, and Ar, for versatile ashing requirements
- Chamber Size: Generous processing chamber of 300 mm (12 inches) for handling multiple substrates
- Temperature Control: Advanced thermal management with programmable heating elements (up to 300°C)
- Control Interface: User-friendly touchscreen with real-time monitoring and data logging capabilities
- Cycle Time: Fast ashing cycles with an average time of 15–30 minutes, boosting throughput
- System Dimensions: Compact design with footprint dimensions of 120 x 80 x 160 cm, perfect for any lab space
- Power Consumption: Energy-efficient operation with a maximum draw of 1.5 kW
Unmatched Advantages:
Exceptional Precision: Our Plasma Ashing System provides controlled and uniform ashing, ensuring that every substrate is treated evenly. Say goodbye to residue and contamination that could compromise your projects!
Versatility at Its Best: Whether you’re in semiconductor manufacturing, MEMS, or even biomedical applications, our system adapts to your specific needs, making it the ideal choice for diverse processes.
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Time-Efficient Operation: With rapid cycle times, you can maximize your productivity. The fast turnaround means less downtime and more throughput for your operations.
User-Centric Design: The intuitive touchscreen interface allows for straightforward operation and real-time feedback, making it accessible for both experienced users and newcomers to plasma technology.
Reliable and Durable: Built with high-quality components, our Plasma Ashing System is designed for longevity and minimal maintenance, providing you with peace of mind and consistent results.
Applications:
- Semiconductor Industry: Essential for removing organic and inorganic residues from wafers prior to photolithography.
- Microelectronics: Perfect for ashing photoresists after etching processes to prepare surfaces for subsequent bonding or layering.
- Surface Preparation: Ideal for cleaning substrates (glass, silicon, metal) in nanotechnology and materials science research.
Elevate your material processing capabilities and reduce your costs simultaneously with our advanced Plasma Ashing System. Join the multitude of satisfied customers who have transformed their operations with our technology.
Don’t miss out on the opportunity to enhance your processes! Contact us today to learn more about how the Plasma Ashing System can meet your needs, or request a quote to start your journey towards precision and efficiency.
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